KSM26RD8L/16MEI

Teknik Özellikler

Number Of Chip Per Module

18

Maximum Operating Temperature C

85

Package Length

133.35

Hts

8473.30.11.40

Supplier Package

RDIMM

Ecc Support

Yes

RoHS Durumu

RoHS Compliant

Eccn Us

EAR99

Operating Current Ma

1629

Data Bus Width Bit

72

Minimum Operating Temperature C

0

Parça Durumu

Obsolete

Mounting

Socket

Module

DRAM Module

Typical Operating Supply Voltage V

1.2

Package Height

18.75

Pin Sayısı

288

Cas Latency

19

Chip Density Bit

8G

Chip Package Type

FBGA

Module Density

16Gbyte

Chip Configuration

1Gx8

Number Of Ranks

Dual

Pcb Changed

288

Maximum Clock Rate Mhz

2666

Organization

2Gx72

Module Type

288DIMM