KSM26RD8/32MEI

Teknik Özellikler

Maximum Clock Rate Mhz

2666

Organization

4Gx72

Pll

No

Module Type

288RDIMM

Chip Configuration

2Gx8

Number Of Ranks

Dual

Pcb Changed

288

Cas Latency

19

Chip Density Bit

16G

Spd Eeprom Support

No

Chip Package Type

FBGA

Module Density

32Gbyte

Typical Operating Supply Voltage V

1.2

Pin Sayısı

288

Package Height

31.25

Self Refresh

Yes

Module Sides

Double

Parça Durumu

Active

Minimum Operating Temperature C

0

Mounting

Socket

Module

DRAM Module

Ecc Support

Yes

RoHS Durumu

RoHS Compliant

Eccn Us

4A994.a

Data Bus Width Bit

72

Operating Current Ma

1656

Maximum Operating Temperature C

85

Package Length

133.35

Hts

8473.30.11.40

Supplier Package

RDIMM

Number Of Chip Per Module

18