HTP ENG KIT 01

Teknik Özellikler

Applications

Boardflex Sensitive, Downhole, General Purpose

Capacitance Range

1500pF~220μF

Nominal Gerilim

10V~500V

Özellikler

Low ESL, High Voltage, High Temperature, Soft Termination

Packages Included

0402 ~ 2917 (1005 ~ 7343 Metric), Radial

RoHS Durumu

ROHS3 Compliant

Parça Durumu

Active

Quantity

200 Pieces (Assorted Per Value)

Nem Hassasiyeti (MSL)

1 (Unlimited)

Ambalaj

Binder

Tolerans

±2.5% ±5% ±10%

Kit Type

Ceramic, Tantalum

Montaj Tipi

Surface Mount, Through Hole

Yayın Yılı

2017

Fabrika Tedarik Süresi

24 Weeks