IS25LE256E-RHLE

Teknik Özellikler

REACH Uyumluluk Kodu

unknown

Package Description

TBGA,

Tepe Reflow Süresi (maks. sn)

30

Temperature Grade

INDUSTRIAL

Tepe Reflow Sıcaklığı (°C)

260

Parallelserial

SERIAL

Supply Voltagemin Vsup

2.7 V

Package Shape

RECTANGULAR

Alternate Memory Width

1

Memory Ic Type

FLASH

Package Code

TBGA

Part Life Cycle Code

Active

Memory Width

8

Operating Temperaturemin

-40 °C

Package Style

GRID ARRAY, THIN PROFILE

Organization

32MX8

Operating Temperaturemax

105 °C

Terminal Pozisyonu

BOTTOM

Terminal Adımı

1 mm

Number Of Words

33554432 words

Number Of Terminals

24

Programming Voltage

3 V

Uzunluk

8 mm

Operating Mode

SYNCHRONOUS

ECCN Kodu

EAR99

Terminal Formu

BALL

Fonksiyon Sayısı

1

Supply Voltagemax Vsup

3.6 V

Supply Voltagenom Vsup

3 V

HTS Kodu

8542.32.00.51

Memory Density

268435456 bit

Jesd30 Code

R-PBGA-B24

Number Of Words Code

32000000

Ihs Manufacturer

INTEGRATED SILICON SOLUTION INC

Package Body Material

PLASTIC/EPOXY

Seated Heightmax

1.2 mm

Clock Frequencymax Fclk

166 MHz

Yüzey Montaj

YES

Genişlik

6 mm