ICSSSTUAF32868AHLF

Teknik Özellikler

Supply Voltagenom Vsup

1.8 V

Package Style

GRID ARRAY, FINE PITCH

Tepe Reflow Süresi (maks. sn)

30

Package Description

FBGA, BGA176,8X22,25

Logic Ic Type

BUS DRIVER

Package Body Material

PLASTIC/EPOXY

Moisture Sensitivity Levels

3

Yüzey Montaj

YES

Jesd30 Code

R-PBGA-B176

JESD-609 Kodu

e1

Package Code

FBGA

Operating Temperaturemax

70 °C

Number Of Terminals

176

Package Shape

RECTANGULAR

Terminal Kaplaması

TIN SILVER COPPER

HTS Kodu

8542.39.00.01

Terminal Formu

BALL

Part Life Cycle Code

Obsolete

Terminal Adımı

0.635 mm

Temperature Grade

COMMERCIAL

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Qualification Status

Not Qualified

Terminal Pozisyonu

BOTTOM

Package Equivalence Code

BGA176,8X22,25

REACH Uyumluluk Kodu

unknown

Tepe Reflow Sıcaklığı (°C)

260

Rohs Code

Yes