Freescale Semiconductor, Inc. (NXP Semiconductors)
XPC860ENZP50C1
Microprocessors
StoktaRoHS: Compliant
Sevkiyat
Stoktan aynı gün hazırlık
Orijinal ürün
Doğrulanmış tedarik
RoHS
Compliant
Destek
Teknik ekip desteği
Teknik Özellikler
- Rohs Code
- No
- Eu Rohs
- Supplier Unconfirmed
- Qualification Status
- Not Qualified
- Supplier Package
- BGA
- Part Package Code
- BGA
- Uzunluk
- 25 mm
- Supply Voltagenom
- 3.3 V
- I2s
- 0
- External Data Bus Width
- 32
- Power Supplies
- 3.3 V
- Genişlik
- 25 mm
- Address Bus Width
- 32
- Bit Size
- 32
- Automotive
- No
- Number Of Terminals
- 357
- Multiply Accumulate
- No
- Package Length
- 25
- Package Body Material
- PLASTIC/EPOXY
- Speed
- 50 MHz
- Package Style
- GRID ARRAY
- Terminal Formu
- BALL
- Seated Heightmax
- 2.05 mm
- Upsucsperipheral Ics Type
- MICROPROCESSOR, RISC
- Usart
- 0
- Reflow Temperaturemax S
- NOT SPECIFIED
- Ppap
- No
- Risk Rank
- 5.74
- Package Shape
- SQUARE
- Mounting
- Surface Mount
- Jesd30 Code
- S-PBGA-B357
- Supply Voltagemin
- 3.135 V
- Terminal Adımı
- 1.27 mm
- I2c
- 0
- Can
- 0
- Lead Shape
- Ball
- Package Code
- BGA
- Pcb Changed
- 357
- Supply Voltagemax
- 3.465 V
- Part Life Cycle Code
- Obsolete
- Terminal Kaplaması
- Tin/Lead (Sn/Pb)