PPC8541EPX533J

Teknik Özellikler

Package Style

GRID ARRAY

JESD-609 Kodu

e0

Terminal Pozisyonu

BOTTOM

REACH Uyumluluk Kodu

not_compliant

Rohs Code

No

Jesd30 Code

S-PBGA-B783

Terminal Formu

BALL

Part Life Cycle Code

Obsolete

Terminal Kaplaması

TIN LEAD SILVER

Moisture Sensitivity Levels

3

Package Description

BGA, BGA783,28X28,40

Number Of Terminals

783

Tepe Reflow Süresi (maks. sn)

30

Package Code

BGA

Package Shape

SQUARE

Package Body Material

PLASTIC/EPOXY

Qualification Status

Not Qualified

Speed

333 MHz

Package Equivalence Code

BGA783,28X28,40

Ihs Manufacturer

FREESCALE SEMICONDUCTOR INC

Tepe Reflow Sıcaklığı (°C)

245

HTS Kodu

8542.31.00.01

Terminal Adımı

1 mm

Bit Size

32

Upsucsperipheral Ics Type

MICROPROCESSOR, RISC

Yüzey Montaj

YES