MC7447RX1267LB

Teknik Özellikler

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Moisture Sensitivity Levels

1

JESD-609 Kodu

e0

Low Power Mode

YES

Terminal Adımı

1.27 mm

Terminal Formu

BALL

Package Equivalence Code

BGA360,19X19,50

Integrated Cache

YES

REACH Uyumluluk Kodu

not_compliant

Number Of Terminals

360

Part Life Cycle Code

Obsolete

Genişlik

25 mm

Tepe Reflow Süresi (maks. sn)

30

Supply Voltagenom

1.3 V

Terminal Pozisyonu

BOTTOM

Seated Heightmax

3.2 mm

Ihs Manufacturer

FREESCALE SEMICONDUCTOR INC

Rohs Code

No

Boundary Scan

YES

Supply Voltagemax

1.35 V

Bit Size

32

Speed

1267 MHz

Address Bus Width

36

Supply Voltagemin

1.25 V

Format

FLOATING POINT

Jesd30 Code

S-CBGA-B360

Upsucsperipheral Ics Type

MICROPROCESSOR, RISC

Clock Frequencymax

167 MHz

Package Code

BGA

Pin Sayısı

360

Tepe Reflow Sıcaklığı (°C)

220

Package Style

GRID ARRAY

Package Description

25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

External Data Bus Width

64

HTS Kodu

8542.31.00.01

ECCN Kodu

3A991.A.2

Uzunluk

25 mm

Part Package Code

BGA

Qualification Status

Not Qualified

Terminal Kaplaması

Tin/Lead (Sn/Pb)