896-068-521-204

Teknik Özellikler

Insulation Resistance

5000 MOhms

Montaj Stili

Panel Mount

Flange Feature

Flush Mount, Top Opening, Unthreaded, 0.156 (3.96mm) Dia

Contact Finish Thickness

10.0µin (0.25µm)

Contact Type

Cantilever

Card Thickness

0.054 ~ 0.070 (1.37mm ~ 1.78mm)

Temel Ürün No

896-068

Card Type

Non Specified - Dual Edge

Contact Plating

Gold

Pitch

3.175 mm

Ürün Durumu

Active

Number Of Positionsbayrow

34

Pozisyon Sayısı

68 Position

Montaj Tipi

Through Hole

Fabrika Paket Adedi

1

Gender

Female

Minimum Operating Temperature

- 40 C

Board Thickness

1.57 mm

Sıra Sayısı

2 Row

Çalışma Sıcaklığı

-40°C ~ 125°C

RoHS

Details

Terminal Stili

Solder Pin

Read Out

Dual

Maks. Çalışma Sıcaklığı

+ 125 C

Seri

896

Mounting Angle

Vertical

Housing Material

Polyphenylene Sulfide (PPS)

Paket

Bulk

Terminal

Solder

Renk

Black

Contact Materials

Copper Alloy

Akım Değeri

3 A

Contact Finish

Gold

Material Insulation

Polyphenylene Sulfide (PPS)