895-144-500-212

Teknik Özellikler

Contact Finish Thickness

10.0µin (0.25µm)

Montaj Tipi

Through Hole

Read Out

Dual

Seri

895

Paket

Bulk

Pitch

2.54 mm

Contact Type

Cantilever

RoHS

Details

Card Type

Non Specified - Dual Edge

Montaj Stili

Panel Mount

Number Of Positionsbayrow

72

Minimum Operating Temperature

- 40 C

Renk

Black

Contact Finish

Gold

Gender

Female

Sıra Sayısı

2 Row

Akım Değeri

3 A

Mounting Angle

Vertical

Terminal

Solder Eyelet(s)

Temel Ürün No

895-144

Card Thickness

0.054 ~ 0.070 (1.37mm ~ 1.78mm)

Contact Materials

Copper Alloy

Board Thickness

1.57 mm

Flange Feature

Flush Mount, Side Opening, Unthreaded, 0.128 (3.25mm) Dia

Material Insulation

Polyphenylene Sulfide (PPS)

Ürün Durumu

Active

Maks. Çalışma Sıcaklığı

+ 125 C

Contact Plating

Gold

Fabrika Paket Adedi

1

Housing Material

Polyphenylene Sulfide (PPS)

Çalışma Sıcaklığı

-40°C ~ 125°C

Terminal Stili

Wire Hole

Pozisyon Sayısı

144 Position

Insulation Resistance

5000 MOhms