895-030-558-812

Teknik Özellikler

Contact Finish

Gold

Terminal

Solder

Card Thickness

0.054 ~ 0.070 (1.37mm ~ 1.78mm)

Pitch

2.54 mm

Pozisyon Sayısı

30 Position

Material Insulation

Polyphenylene Sulfide (PPS)

Maks. Çalışma Sıcaklığı

+ 125 C

Montaj Stili

Panel Mount

Paket

Bulk

Contact Finish Thickness

10.0µin (0.25µm)

Housing Material

Polyphenylene Sulfide (PPS)

Contact Type

Cantilever

Card Type

Non Specified - Dual Edge

Board Thickness

1.57 mm

Çalışma Sıcaklığı

-40°C ~ 125°C

Gender

Female

Mounting Angle

Right Angle

Akım Değeri

3 A

Number Of Positionsbayrow

15

Renk

Black

Minimum Operating Temperature

- 40 C

Read Out

Dual

Fabrika Paket Adedi

1

Contact Plating

Gold

Seri

895

Ürün Durumu

Active

RoHS

Details

Montaj Tipi

Through Hole, Right Angle

Terminal Stili

Solder Pin

Sıra Sayısı

2 Row

Flange Feature

Side Mount Opening, Unthreaded, 0.128 (3.25mm) Dia

Contact Materials

Copper Alloy

Temel Ürün No

895-030

Insulation Resistance

5000 MOhms