895-021-523-603

Teknik Özellikler

Renk

Black

Insulation Resistance

5000 MOhms

Card Thickness

0.054 ~ 0.070 (1.37mm ~ 1.78mm)

Terminal Stili

Solder Pin

Flange Feature

Top Mount Opening, Floating Bobbin, 0.116 (2.95mm) Dia

Board Thickness

1.57 mm

Pitch

2.54 mm

Akım Değeri

3 A

Seri

895

Sıra Sayısı

1 Row

Ürün Durumu

Active

Minimum Operating Temperature

- 40 C

Contact Plating

Gold

Temel Ürün No

895-021

Mounting Angle

Vertical

Montaj Tipi

Through Hole

Maks. Çalışma Sıcaklığı

+ 125 C

Contact Finish

Gold

Paket

Bulk

Contact Type

Cantilever

Contact Finish Thickness

10.0µin (0.25µm)

Montaj Stili

Panel Mount

Housing Material

Polyphenylene Sulfide (PPS)

Çalışma Sıcaklığı

-40°C ~ 125°C

Gender

Female

Material Insulation

Polyphenylene Sulfide (PPS)

Fabrika Paket Adedi

1

Card Type

Non Specified - Single Edge

Number Of Positionsbayrow

21

Contact Materials

Copper Alloy

Terminal

Solder

Read Out

Single

Pozisyon Sayısı

21 Position

RoHS

Details