895-019-521-103

Teknik Özellikler

Mounting Angle

Vertical

Seri

895

Akım Değeri

3 A

Contact Type

Cantilever

Number Of Positionsbayrow

19

Flange Feature

Flush Mount, Floating Bobbin, 0.116 (2.95mm) Dia

Renk

Black

Çalışma Sıcaklığı

-40°C ~ 125°C

Sıra Sayısı

1 Row

Contact Finish

Gold

Terminal

Solder

Terminal Stili

Solder Pin

Board Thickness

1.57 mm

Temel Ürün No

895-019

Insulation Resistance

5000 MOhms

Contact Finish Thickness

10.0µin (0.25µm)

Minimum Operating Temperature

- 40 C

Gender

Female

Fabrika Paket Adedi

1

Maks. Çalışma Sıcaklığı

+ 125 C

Card Thickness

0.054 ~ 0.070 (1.37mm ~ 1.78mm)

Pozisyon Sayısı

19 Position

Contact Materials

Copper Alloy

Contact Plating

Gold

Read Out

Single

Paket

Bulk

RoHS

Details

Card Type

Non Specified - Single Edge

Ürün Durumu

Active

Montaj Tipi

Through Hole

Housing Material

Polyphenylene Sulfide (PPS)

Pitch

2.54 mm

Material Insulation

Polyphenylene Sulfide (PPS)

Montaj Stili

Panel Mount