S71VS256RD0AHKBL0

Teknik Özellikler

Package Description

FBGA, BGA56,10X14,20

Package Shape

RECTANGULAR

ECCN Kodu

EAR99

Mixed Memory Type

FLASH+PSRAM

HTS Kodu

8542.32.00.71

Terminal Formu

BALL

Package Code

FBGA

Terminal Adımı

0.5 mm

Supply Voltagenom Vsup

1.8 V

Qualification Status

Not Qualified

Temperature Grade

OTHER

Operating Temperaturemax

85 °C

Package Body Material

PLASTIC/EPOXY

Tepe Reflow Süresi (maks. sn)

40

REACH Uyumluluk Kodu

compliant

Package Style

GRID ARRAY, FINE PITCH

Ihs Manufacturer

CYPRESS SEMICONDUCTOR CORP

Rohs Code

Yes

Terminal Pozisyonu

BOTTOM

Package Equivalence Code

BGA56,10X14,20

Yüzey Montaj

YES

Operating Temperaturemin

-25 °C

Jesd30 Code

R-PBGA-B56

Memory Ic Type

MEMORY CIRCUIT

Part Life Cycle Code

Transferred

Number Of Terminals

56

Tepe Reflow Sıcaklığı (°C)

260