EXN-23409-PCB

Teknik Özellikler

Plating

Non-Plated Through Hole (NPTH)

RoHS Durumu

ROHS3 Compliant

Nem Hassasiyeti (MSL)

Not Applicable

Parça Durumu

Active

Hole Diameter

0.051 (1.30mm)

Circuit Pattern

Pad Per Hole (Round)

Boyut / Ölçü

7.56Lx5.11W 192.0mmx129.8mm

Pitch

0.100 2.54mm

Proto Board Type

Breadboard, General Purpose

Material

Silicon

Seri

EXN

Fabrika Tedarik Süresi

11 Weeks

Board Thickness

0.063 1.60mm