ADSP-CM409CBCZAFRL

Teknik Özellikler

Contact Material Mating

Beryllium Copper

Maks. Çalışma Sıcaklığı

+ 105 C

Parça Durumu

Obsolete

Tedarikçi Cihaz Paketi

212-CSPBGA (19x19)

Onchip Ram

384kB

Housing Material

Aluminum Alloy

Contact Resistance

10 mOhm

Kılıf / Paket

212-LBGA, CSPBGA

Pitch Post

0.100 (2.54mm)

Program Memory Size

2 MB

Montaj Tipi

Through Hole

Pitch Mating

0.100 (2.54mm)

L1 Cache Data Memory

16 kB

Maximum Clock Frequency

240 MHz

Contact Finish Thickness Mating

20.0µin (0.51µm)

Terminal

Solder

Clock Rate

240MHz

Interface

CAN, Ethernet, I²C, SPI, SPORT, UART/USART, USB

Seri

700

Contact Finish Mating

Gold

Özellikler

Carrier, Closed Frame

Tip

DIP, 0.3 (7.62mm) Row Spacing

Minimum Operating Temperature

- 40 C

Temel Ürün No

ADSP-CM409

Operating Supply Voltage

3.3 V

Contact Finish Post

Gold

Material Flammability Rating

UL94 V-0

Voltage Core

1.20V

Paket

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Ürün Durumu

Active

Contact Finish Thickness Post

20.0µin (0.51µm)

Voltage Io

3.30V

Data Ram Size

384 kB

Akım Değeri

3A

Number Of Positions Or Pins Grid

8 (2 x 4)

Termination Post Length

0.125 (3.18mm)

Montaj Stili

SMD/SMT

Nonvolatile Memory

FLASH (2MB)

Contact Material Post

Beryllium Copper

Çalışma Sıcaklığı

-55°C ~ 125°C