XCZU9CG-1SBVA484I

Teknik Özellikler

Package Description

BGA-484

Terminal Kaplaması

TIN SILVER COPPER

Part Life Cycle Code

Active

Tepe Reflow Süresi (maks. sn)

30

Operating Temperaturemax

100 °C

Tepe Reflow Sıcaklığı (°C)

250

Terminal Formu

BALL

HTS Kodu

8542.31.00.01

Genişlik

19 mm

Jesd30 Code

S-PBGA-B484

Package Shape

SQUARE

Yüzey Montaj

YES

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Moisture Sensitivity Levels

4

Supply Voltagemax

0.876 V

Bus Compatibility

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

Temperature Grade

INDUSTRIAL

Supply Voltagenom

0.85 V

Rohs Code

Yes

Terminal Pozisyonu

BOTTOM

JESD-609 Kodu

e1

Supply Voltagemin

0.825 V

Terminal Adımı

0.8 mm

Package Style

GRID ARRAY, FINE PITCH

REACH Uyumluluk Kodu

compliant

Package Body Material

PLASTIC/EPOXY

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Number Of Terminals

484

Package Code

FBGA

Seated Heightmax

2.61 mm

Operating Temperaturemin

-40 °C

Package Equivalence Code

BGA484,22X22,32

Uzunluk

19 mm