XCZU7EG-3FBVB900I

Teknik Özellikler

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Number Of Terminals

900

Date Of Intro

2017-02-15

Package Code

BGA

Seated Heightmax

2.97 mm

Operating Temperaturemin

-40 °C

Uzunluk

31 mm

Terminal Pozisyonu

BOTTOM

JESD-609 Kodu

e1

Supply Voltagenom

0.9 V

Rohs Code

Yes

Terminal Adımı

1 mm

REACH Uyumluluk Kodu

compliant

Package Style

GRID ARRAY

Package Body Material

PLASTIC/EPOXY

Jesd30 Code

S-PBGA-B900

Genişlik

31 mm

Yüzey Montaj

YES

Package Shape

SQUARE

Moisture Sensitivity Levels

4

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Temperature Grade

INDUSTRIAL

Package Description

FCBGA-900

Operating Temperaturemax

100 °C

Tepe Reflow Süresi (maks. sn)

30

Tepe Reflow Sıcaklığı (°C)

245

Terminal Kaplaması

TIN SILVER COPPER

Part Life Cycle Code

Active

Terminal Formu

BALL

HTS Kodu

8542.31.00.01