XCZU7EG-2LFBVB900E

Teknik Özellikler

Uzunluk

31 mm

Package Code

BGA

Seated Heightmax

2.88 mm

Package Equivalence Code

BGA900,30X30,40

Number Of Terminals

900

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Body Material

PLASTIC/EPOXY

Terminal Adımı

1 mm

Package Style

GRID ARRAY

REACH Uyumluluk Kodu

compliant

Supply Voltagenom

0.85 V

Rohs Code

Yes

Terminal Pozisyonu

BOTTOM

JESD-609 Kodu

e1

Bus Compatibility

CAN, I2C, SPI, UART

Temperature Grade

OTHER

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Moisture Sensitivity Levels

4

Yüzey Montaj

YES

Package Shape

SQUARE

Genişlik

31 mm

Jesd30 Code

S-PBGA-B900

Terminal Formu

BALL

Terminal Kaplaması

TIN SILVER COPPER

Part Life Cycle Code

Active

Tepe Reflow Süresi (maks. sn)

30

Operating Temperaturemax

110 °C

Tepe Reflow Sıcaklığı (°C)

245

Package Description

FCBGA-900