XCZU7CG-2LFBVB900E

Teknik Özellikler

Package Description

FCBGA-900

Tepe Reflow Sıcaklığı (°C)

245

Tepe Reflow Süresi (maks. sn)

30

Operating Temperaturemax

110 °C

Terminal Kaplaması

TIN SILVER COPPER

Part Life Cycle Code

Active

Terminal Formu

BALL

Jesd30 Code

S-PBGA-B900

Genişlik

31 mm

Yüzey Montaj

YES

Package Shape

SQUARE

Moisture Sensitivity Levels

4

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Temperature Grade

OTHER

Bus Compatibility

CAN, I2C, SPI, UART

Terminal Pozisyonu

BOTTOM

JESD-609 Kodu

e1

Rohs Code

Yes

Supply Voltagenom

0.85 V

Package Style

GRID ARRAY

REACH Uyumluluk Kodu

compliant

Terminal Adımı

1 mm

Package Body Material

PLASTIC/EPOXY

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Number Of Terminals

900

Package Equivalence Code

BGA900,30X30,40

Seated Heightmax

2.88 mm

Package Code

BGA

Uzunluk

31 mm