XCZU6CG-1SFVC784E

Teknik Özellikler

Package Equivalence Code

BGA78428X28,32

Package Code

FBGA

Seated Heightmax

3.32 mm

Uzunluk

23 mm

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Number Of Terminals

784

Package Body Material

PLASTIC/EPOXY

JESD-609 Kodu

e1

Terminal Pozisyonu

BOTTOM

Supply Voltagemin

0.825 V

Supply Voltagenom

0.85 V

Rohs Code

Yes

REACH Uyumluluk Kodu

compliant

Package Style

GRID ARRAY, FINE PITCH

Terminal Adımı

0.8 mm

Moisture Sensitivity Levels

4

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Bus Compatibility

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

Temperature Grade

OTHER

Supply Voltagemax

0.876 V

Jesd30 Code

S-PBGA-B784

Genişlik

23 mm

Package Shape

SQUARE

Yüzey Montaj

YES

Terminal Formu

BALL

HTS Kodu

8542.31.00.01

Package Description

BGA-784

Tepe Reflow Süresi (maks. sn)

30

Operating Temperaturemax

100 °C

Tepe Reflow Sıcaklığı (°C)

250

Part Life Cycle Code

Active

Terminal Kaplaması

TIN SILVER COPPER