XCZU6CG-1SFVA625E

Teknik Özellikler

Supply Voltagemax

0.876 V

Bus Compatibility

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

Temperature Grade

OTHER

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Moisture Sensitivity Levels

4

Package Shape

SQUARE

Yüzey Montaj

YES

Genişlik

21 mm

Jesd30 Code

S-PBGA-B625

HTS Kodu

8542.31.00.01

Terminal Formu

BALL

Terminal Kaplaması

TIN SILVER COPPER

Part Life Cycle Code

Active

Tepe Reflow Süresi (maks. sn)

30

Operating Temperaturemax

100 °C

Tepe Reflow Sıcaklığı (°C)

250

Package Description

BGA-625

Uzunluk

21 mm

Seated Heightmax

3.43 mm

Package Code

FBGA

Package Equivalence Code

BGA625,25X25,32

Number Of Terminals

625

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Body Material

PLASTIC/EPOXY

Terminal Adımı

0.8 mm

REACH Uyumluluk Kodu

compliant

Package Style

GRID ARRAY, FINE PITCH

Supply Voltagenom

0.85 V

Rohs Code

Yes

Terminal Pozisyonu

BOTTOM

JESD-609 Kodu

e1

Supply Voltagemin

0.825 V