XCZU5EV-2LSFVC784E

Teknik Özellikler

Terminal Formu

BALL

Terminal Kaplaması

TIN SILVER COPPER

Part Life Cycle Code

Active

Tepe Reflow Süresi (maks. sn)

30

Operating Temperaturemax

110 °C

Tepe Reflow Sıcaklığı (°C)

250

Package Description

FCBGA-784

Bus Compatibility

CAN, I2C, SPI, UART

Temperature Grade

OTHER

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Moisture Sensitivity Levels

4

Package Shape

SQUARE

Yüzey Montaj

YES

Genişlik

23 mm

Jesd30 Code

S-PBGA-B784

Package Body Material

PLASTIC/EPOXY

Package Style

GRID ARRAY, FINE PITCH

REACH Uyumluluk Kodu

compliant

Terminal Adımı

0.8 mm

Supply Voltagenom

0.85 V

Rohs Code

Yes

JESD-609 Kodu

e1

Terminal Pozisyonu

BOTTOM

Uzunluk

23 mm

Seated Heightmax

3.32 mm

Package Code

FBGA

Package Equivalence Code

BGA784,28X28,32

Number Of Terminals

784

Ihs Manufacturer

ADVANCED MICRO DEVICES INC