XCZU5CG-2LSFVC784I

Teknik Özellikler

JESD-609 Kodu

e1

Supply Voltagenom

0.85 V

Uzunluk

23 mm

Yüzey Montaj

YES

Tepe Reflow Sıcaklığı (°C)

250

Package Body Material

PLASTIC/EPOXY

Package Shape

SQUARE

Jesd30 Code

S-PBGA-B784

Package Description

FCBGA-784

Bus Compatibility

CAN, I2C, SPI, UART

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

REACH Uyumluluk Kodu

compliant

Genişlik

23 mm

Part Life Cycle Code

Active

Terminal Formu

BALL

Package Equivalence Code

BGA784,28X28,32

Rohs Code

Yes

Operating Temperaturemax

100 °C

Moisture Sensitivity Levels

4

Operating Temperaturemin

-40 °C

Package Code

FBGA

Seated Heightmax

3.32 mm

Terminal Kaplaması

TIN SILVER COPPER

Terminal Adımı

0.8 mm

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Number Of Terminals

784

Tepe Reflow Süresi (maks. sn)

30

Terminal Pozisyonu

BOTTOM

Temperature Grade

INDUSTRIAL

Package Style

GRID ARRAY, FINE PITCH