XCZU5CG-1LFBVB900I

Teknik Özellikler

Rohs Code

Yes

Operating Temperaturemax

100 °C

REACH Uyumluluk Kodu

compliant

Genişlik

31 mm

Part Life Cycle Code

Active

Terminal Formu

BALL

Package Equivalence Code

BGA900,30X30,40

Tepe Reflow Sıcaklığı (°C)

245

Package Body Material

PLASTIC/EPOXY

Package Shape

SQUARE

Jesd30 Code

S-PBGA-B900

Bus Compatibility

CAN, I2C, SPI, UART

Package Description

FCBGA-900

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

JESD-609 Kodu

e1

Uzunluk

31 mm

Supply Voltagenom

0.85 V

Yüzey Montaj

YES

Terminal Pozisyonu

BOTTOM

Temperature Grade

INDUSTRIAL

Package Style

GRID ARRAY

Terminal Adımı

1 mm

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Number Of Terminals

900

Tepe Reflow Süresi (maks. sn)

30

Seated Heightmax

2.88 mm

Terminal Kaplaması

TIN SILVER COPPER

Moisture Sensitivity Levels

4

Package Code

BGA

Operating Temperaturemin

-40 °C