XCVM1402-2MSENSVF1369

Teknik Özellikler

Speed

600MHz, 1.4GHz

Tedarikçi Cihaz Paketi

1369-BGA (35x35)

Lifecycle Status

Obsolete (Last Updated: 2 years ago)

Yükseklik

8.382 mm

Weight

5.800001 g

Architecture

MPU, FPGA

Seri

Versal™ Prime

Genişlik

21.082 mm

Kılıf / Paket

1369-BFBGA

Peripherals

DDR, DMA, PCIe

Uzunluk

22.86 mm

Paket

Tray

Ürün Durumu

Active

Manufacturer Lifecycle Status

OBSOLETE (Last Updated: 2 years ago)

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Primary Attributes

Versal™ Prime FPGA, 1.2M Logic Cells

Core Processor

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

Çalışma Sıcaklığı

0°C ~ 100°C (TJ)

Number Of Ios

424

RoHS

Compliant