SC1100UFH-233

Teknik Özellikler

Genişlik

35 mm

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Code

HBGA

Package Description

35 X 35 MM, 2.38 MM HEIGHT, 1.27 MM PITCH, MS-034BAR-2, TEPBGA-388

Package Shape

SQUARE

Bit Size

32

Package Equivalence Code

BGA388,26X26,50

Part Package Code

BGA

Pin Sayısı

388

Number Of Terminals

388

Operating Temperaturemax

85 °C

Terminal Formu

BALL

Temperature Grade

OTHER

Moisture Sensitivity Levels

3

REACH Uyumluluk Kodu

not_compliant

Address Bus Width

13

Terminal Pozisyonu

BOTTOM

Integrated Cache

YES

Format

FLOATING POINT

External Data Bus Width

64

Tepe Reflow Süresi (maks. sn)

30

Speed

233 MHz

Package Style

GRID ARRAY, HEAT SINK/SLUG

Jesd30 Code

S-PBGA-B388

Boundary Scan

YES

HTS Kodu

8542.31.00.01

Supply Voltagemin

1.71 V

Rohs Code

No

Part Life Cycle Code

Obsolete

Low Power Mode

YES

Qualification Status

Not Qualified

Package Body Material

PLASTIC/EPOXY

Terminal Adımı

1.27 mm

Terminal Kaplaması

TIN LEAD

Clock Frequencymax

27 MHz

Seated Heightmax

2.59 mm

Tepe Reflow Sıcaklığı (°C)

260

ECCN Kodu

3A991.A.2

Supply Voltagenom

1.8 V

JESD-609 Kodu

e0