AM29DL324GT70WDI

Teknik Özellikler

Part Package Code

BGA

Genişlik

8 mm

Jesd30 Code

R-PBGA-B63

JESD-609 Kodu

e0

Package Body Material

PLASTIC/EPOXY

Terminal Pozisyonu

BOTTOM

Fonksiyon Sayısı

1

Package Equivalence Code

BGA63,8X12,32

Sector Size

8K,64K

Organization

2MX16

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Tepe Reflow Sıcaklığı (°C)

260

Memory Density

33554432 bit

Number Of Sectorssize

8,63

Terminal Adımı

0.8 mm

HTS Kodu

8542.32.00.51

Operating Temperaturemin

-40 °C

Part Life Cycle Code

Transferred

Uzunluk

14 mm

Memory Ic Type

FLASH

Access Timemax

70 ns

Number Of Words Code

2000000

Supply Currentmax

0.045 mA

Standby Currentmax

0.000005 A

Pin Sayısı

63

Package Description

8 X 14 MM, 0.80 MM PITCH, FBGA-63

ECCN Kodu

EAR99

Toggle Bit

YES

Terminal Kaplaması

Tin/Lead (Sn/Pb)

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Supply Voltagemax Vsup

3.6 V

Qualification Status

Not Qualified

Readybusy

YES

Common Flash Interface

YES

Seated Heightmax

1.2 mm

Parallelserial

PARALLEL

Tip

NOR TYPE

REACH Uyumluluk Kodu

unknown

Number Of Words

2097152 words

Temperature Grade

INDUSTRIAL