EPM2210GF324C3N

Teknik Özellikler

Tepe Reflow Sıcaklığı (°C)

260

Genişlik

19 mm

Çalışma Sıcaklığı

0°C ~ 85°C (TJ)

Package Body Material

PLASTIC/EPOXY

REACH Uyumluluk Kodu

compliant

Yüzey Montaj

YES

Supply Voltagenom

1.8 V

Besleme Gerilimi

1.8V

Package Code

BGA

Package Equivalence Code

BGA324,18X18,40

Terminal Kaplaması

TIN SILVER COPPER

Output Function

MACROCELL

Seated Heightmax

2.2 mm

Ambalaj

Tray

Üretici Parça No

EPM2210GF324C3N

Operating Temperaturemax

85 °C

Supply Voltagemax Vsup

1.89V

Propagation Delay

7 ns

Organization

0 DEDICATED INPUTS, 272 I/O

Number Of Macrocells

1700

Insystem Programmable

YES

Qualification Status

Not Qualified

Jesd30 Code

S-PBGA-B324

Tepe Reflow Süresi (maks. sn)

40

Ihs Manufacturer

INTEL CORP

Rohs Code

Yes

Temel Parça No

EPM2210

Package Style

GRID ARRAY

Jtag Bst

YES

Temperature Grade

OTHER

Montaj Tipi

Surface Mount

RoHS Durumu

RoHS Compliant

Fabrika Tedarik Süresi

8 Weeks

HTS Kodu

8542.39.00.01

Delay Time Tpd1 Max

7.0ns

ECCN Kodu

3A991

Terminal Formu

BALL

Programmable Type

In System Programmable

Package Description

BGA, BGA324,18X18,40

Reflow Temperaturemax S

40