EPM2210GF256C3N

Teknik Özellikler

Package Body Material

PLASTIC/EPOXY

Tepe Reflow Sıcaklığı (°C)

260

Genişlik

17 mm

Çalışma Sıcaklığı

0°C ~ 85°C (TJ)

REACH Uyumluluk Kodu

compliant

Yüzey Montaj

YES

Supply Voltagenom

1.8 V

Besleme Gerilimi

1.8V

Package Code

BGA

Output Function

MACROCELL

Terminal Kaplaması

Tin/Silver/Copper (Sn/Ag/Cu)

Package Equivalence Code

BGA256,16X16,40

Seated Heightmax

2.2 mm

Operating Temperaturemax

85 °C

Ambalaj

Tray

Üretici Parça No

EPM2210GF256C3N

Number Of Macrocells

1700

Organization

0 DEDICATED INPUTS, 204 I/O

Insystem Programmable

YES

Supply Voltagemax Vsup

1.89V

Propagation Delay

7 ns

Qualification Status

Not Qualified

Jesd30 Code

S-PBGA-B256

Tepe Reflow Süresi (maks. sn)

40

Ihs Manufacturer

INTEL CORP

Rohs Code

Yes

Temel Parça No

EPM2210

Montaj Tipi

Surface Mount

Package Style

GRID ARRAY

Jtag Bst

YES

Temperature Grade

OTHER

RoHS Durumu

RoHS Compliant

Delay Time Tpd1 Max

7.0ns

HTS Kodu

8542.39.00.01

Fabrika Tedarik Süresi

8 Weeks

Package Description

BGA, BGA256,16X16,40

Programmable Type

In System Programmable

Terminal Formu

BALL

Reflow Temperaturemax S

40

ECCN Kodu

3A991