5CSXFC6D6F31C7N

Teknik Özellikler

Supply Voltagemax

1.13 V

RoHS Durumu

RoHS Compliant

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Jesd30 Code

S-PBGA-B896

Seated Heightmax

2 mm

Terminal Adımı

1 mm

Parça Durumu

Active

Nem Hassasiyeti (MSL)

3 (168 Hours)

Terminal Sayısı

896

Supply Voltagemin Vsup

1.07V

Ihs Manufacturer

INTEL CORP

Package Shape

SQUARE

Part Life Cycle Code

Active

Package Description

BGA, BGA896,30X30,40

Number Of Logic Cells

110000

Yüzey Montaj

YES

Power Supplies

1.1,1.2/3.3,2.5 V

Maks. Oturma Yüksekliği

2mm

Fabrika Tedarik Süresi

8 Weeks

Primary Attributes

FPGA - 110K Logic Elements

Supply Voltagemax Vsup

1.13V

Tedarikçi Cihaz Paketi

896-FBGA (31x31)

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Temperature Grade

OTHER

Operating Temperaturemax

85 °C

Rohs Code

Yes

Qualification Status

Not Qualified

Ram Size

64KB

Supply Voltagemin

1.07 V

Çalışma Sıcaklığı

0°C ~ 85°C (TJ)

Number Of Inputs

288

Ambalaj

Tray

Üretici Parça No

5CSXFC6D6F31C7N

Supply Voltagenom

1.1 V

Number Of Ios

MCU - 181, FPGA - 288

Yayın Yılı

2018

Package Equivalence Code

BGA896,30X30,40

Package Style

GRID ARRAY

Reflow Temperaturemax S

NOT SPECIFIED