10AS048E2F29I2LG

Teknik Özellikler

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Maks. Oturma Yüksekliği

0.022 (0.55mm)

Peripherals

DMA, POR, WDT

Number Of Inputs

360

Package Shape

SQUARE

Paket

Tape & Reel (TR)

Fabrika Tedarik Süresi

8 Weeks

Reflow Temperaturemax S

NOT SPECIFIED

Package Body Material

PLASTIC/EPOXY

Jesd30 Code

S-PBGA-B780

Composition

Thin Film

Temperature Grade

INDUSTRIAL

Maximum Clock Frequency

1.2 GHz

Number Of Logic Array Blocks Labs

60000 LAB

Qualification Status

Not Qualified

Temperature Coefficient

±10ppm/°C

Uzunluk

29 mm

Ambalaj

Tray

Tolerans

±0.1%

Risk Rank

5.49

Ürün Durumu

Obsolete

Ihs Manufacturer

INTEL CORP

Ram Size

256KB

Rohs Code

Yes

Supply Voltagemin Vsup

0.87V

Package Description

BGA, BGA780,28X28,40

Number Of Logic Elements

480000 LE

HTS Kodu

8542.39.00.01

Nem Hassasiyeti (MSL)

3 (168 Hours)

Package Style

GRID ARRAY

Package Code

BGA

Supply Voltagemax Vsup

0.93V

Number Of Terminals

780

Power Supplies

0.9 V

Parça Durumu

Active

Architecture

MCU, FPGA

Shipping Restrictions

This product may require additional documentation to export from the United States.

Terminal Formu

BALL

Seri

RN73

Boyut / Ölçü

0.063 L x 0.031 W (1.60mm x 0.80mm)